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辦公室緣起

成立目的

FCU strives to establish and advance crucial areas of technology while fostering industry partnerships to collectively generate research and academic benefits. Consequently, the Office of Technological Development has been established to accomplish these objectives.

新聞與活動

Events

News

Announcement

Category
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Feng Chia University Wins Jury Gold and Bronze Awards in the Application Category at the 26th Macronix Golden Silicon Awards

Array 2026.07.29

The 26th Macronix Golden Silicon Awards – Semiconductor Design and Application Contest, often regarded as the “Oscars” of Taiwan’s electronics and electrical engineering industry, held its awards ceremony on July 25. Competing against 274 teams and nearly 1,000 faculty members and students from 33 universities and colleges nationwide, two student teams from Feng Chia University distinguished themselves by winning the Jury Gold Award and Jury Bronze Award in the Application Category.

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Feng Chia University Receives Six-Year Accreditation, Earning High Recognition for Institutional Excellence

Array 2026.07.20

The Higher Education Evaluation and Accreditation Council of Taiwan (HEEACT) announced the results of the third-cycle institutional accreditation for universities in the second half of Academic Year 2025 on July 14. Feng Chia University received the highest accreditation outcome,“Accredited – Valid for Six Years,” reflecting strong recognition of the University's performance in institutional governance and educational quality.

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FCU Dean Wang Chi-Chang’s Team Wins Inaugural TSIA Semiconductor Equipment Innovation Award

Array 2026.07.15

The Taiwan Semiconductor Industry Association (TSIA) presented its inaugural TSIA Semiconductor Equipment Innovation Award in 2026, with only three universities nationwide receiving the honor. Chi-Chang Wang, Distinguished Professor and Dean of the College of Engineering and Science at Feng Chia University, led students Po-Yao Chen, Yu-Chia Liang, and Ju-En Ku from the Green Power Laboratory to win the award with their project, “Improving Advanced Packaging Furnace Systems and Solving Energy-Saving Challenges Through Thermal and Structural Simulation Analysis Integrated with AI Technologies.”